Preferred Forms
- 100 1 0 ‡a Chen, William T.
- 100 1 _ ‡a Chen, William T.
4xx's: Alternate Name Forms (2)
Works
Title | Sources |
---|---|
Application of fracture mechanics in electronic packaging : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas | |
Jt. Electronic Packaging Conf. (1st : 1992 : Milpitas, Calif.). Joint Conference on Electronic Packaging, 1991: | |
Manufacturing aspects in electronic packaging 1993 : presented at the 1993 ASME Winter Annual Meeting, New Orleans, Louisiana, November 28-December 3, 1993 | |
Manufacturing processes and materials challenges ... c1991: |