TechSearch International
VIAF ID: 140864815 (Corporate)
Permalink: http://viaf.org/viaf/140864815
Preferred Forms
- 110 2 _ ‡a TechSearch International
- 110 2 0 ‡a TechSearch International
- 110 2 _ ‡a TechSearch International
4xx's: Alternate Name Forms (2)
Works
Title | Sources |
---|---|
Advanced packaging update. | |
Ball grid array development update service | |
Chip-size packaging developments. | |
CSP cost analysis | |
Developments in ... quarter | |
Flip chip and wafer level packaging trends and market forecasts. | |
IVF CSP project prestudy state of the industry assessment. | |
Market and technology trends | |
MEMS markets : challenges for packaging and assembly. | |
Surface mount technology : recent Japanese developments | |
System-in-package : the new wave in 3D packaging. |