Agonafer, D.
VIAF ID: 75506786 (Personal)
Permalink: http://viaf.org/viaf/75506786
Preferred Forms
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100 1 _
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Agonafer, D.
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100 1 _
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Agonafer, D.
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100 1 0
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Agonafer, D.
4xx's: Alternate Name Forms (2)
Works
| Title | Sources |
|---|---|
| CAE/CAD and thermal management issues in electronic systems : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas |
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| Computer aided design in electronic packaging |
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| Heat transfer in electronic equipment, 1991, c1991: |
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| InterPACK '99 |
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| Numerical simulation of convection in electronic equipment cooling : presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, San Francisco, California, December 10-15, 1989 |
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| Solutions to CFD benchmark problems in electronic packaging : presented at the 29th National Heat Transfer Conference, Atlanta, Georgia, August 8-11, 1993 |
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