Børgesen, Peter

VIAF ID: 26190789 (Personal)

Title	Sources
Beam-solid interactions, c1990:
Electronic packaging materials science VII : symposium held November 29-December 3, 1993, Boston, Massachusetts, U.S.A
Life-time prediction of solder joints used in surface mount assemblies during thermo-mechanical and isothermal aging
Materials reliability in microelectronics IV : symposium held April 5-8, 1994, San Francisco, California, U.S.A
Prédiction de la durée de vie des joints de brasure de composants montés en surface (CMS) sur substrat céramique soumis à des vieillissements isothermes et thermomécaniques.
Studies on the bombardment of condensed molecular gases at liquid-He temperatures by keV electrons and light ions

Zuhr, Raymond A.. ‎(4)
Knapp, James A.. ‎(4)
Woirgard, Eric (1962-....). ‎(2)
Pollak, Roger A.. ‎(2)
Pocheron, Mickaël (1989-....). ‎(2)
Materials Research Society. Meeting (1994 ; San Francisco, Calif.). ‎(2)
Materials Research Society. ‎(2)
Jansen, Klavs F. (1952-). ‎(2)
Guédon-Gracia, Alexandrine (1978-....). ‎(2)
Symposium on Electronic Packaging Materials Science (Boston, Mass.) (1993). ‎(1)