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Kempa, Stefan Sudoc [ABES], France

VIAF ID: 63153953224405560128 (Personal)

Permalink: http://viaf.org/viaf/63153953224405560128

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Title Sources
Etude du procédé de réticulation d'un composite époxy/silice pour les applications en microélectronique. Sudoc [ABES], France
Investigation of the curing process of an epoxy/silica composite for microelectronics Sudoc [ABES], France

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