Preferred Forms
- 200 _ | ‡a Lau ‡b John H.
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- 100 1 _ ‡a Lau, John H.
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- 100 1 0 ‡a Lau, John H.
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- 100 1 _ ‡a Lau, John H.
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-
- 100 1 _ ‡a Lau, John H.
- 100 1 _ ‡a Lau, John H.
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- 100 1 _ ‡a 류한청
4xx's: Alternate Name Forms (7)
Works
Title | Sources |
---|---|
3D IC integration and packaging | |
Advanced microelectromechanical systems packaging | |
Ball grid array technology | |
Chip on board technologies for multichip modules | |
Chip scale package (CSP) design, materials, processes, reliability, and applications | |
Electronics manufacturing : with lead-free, halogen-free, and conductive-adhesive materials | |
Fan-Out Wafer-Level Packaging | |
Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology | |
Handbook of fine pitch surface mount technology | |
Handbook of tape automated bonding | |
Heterogeneous Integrations | |
Microvias : for low cost, high density interconnects | |
Reliability of RoHS-Compliant 2D and 3D IC interconnects | |
Solder joint reliability of BGA, CSP, flip chip, and fine pitch SMT assemblies | |
Solder joint reliability--theory and applications, c1991: | |
Thermal stress and strain in microelectronics packaging | |
Thirteenth IEEE/CHMT International Electronics Manufacturing Technology Symposium : integrated manufacturing, the future is now : September 28-30, 1992, Baltimore, MD, USA | |
Through-silicon Vias for 3d Integration |