Dunn, Barrie D., 1945-....
Dunn, B.D.
Dunn, Barrie D.
Barrie D. Dunn Britský materiálový inženýr, metalurg, vědec a vysokoškolský učitel. Zabývá se whiskery cínu, korozí a vlivy, které má prostředí kosmu na různé materiály. Publikuje v oboru působnosti.
VIAF ID: 305244458 ( Personal )
Permalink: http://viaf.org/viaf/305244458
Preferred Forms
- 100 0 _ ‡a Barrie D. Dunn ‡c Britský materiálový inženýr, metalurg, vědec a vysokoškolský učitel. Zabývá se whiskery cínu, korozí a vlivy, které má prostředí kosmu na různé materiály. Publikuje v oboru působnosti.
- 200 _ | ‡a Dunn ‡b Barrie D. ‡f 1945-....
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- 100 1 _ ‡a Dunn, Barrie D.
- 100 1 _ ‡a Dunn, Barrie D.
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- 100 1 _ ‡a Dunn, Barrie D. ‡d 1945-
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- 100 1 0 ‡a Dunn, Barrie D., ‡d 1945-
- 100 1 _ ‡a Dunn, Barrie D., ‡d 1945-....
4xx's: Alternate Name Forms (8)
Works
Title | Sources |
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Assessment of chemical conversion coatings for the protection of aluminium alloys : a comparison of Alodine 1200 with chromium-free conversion coatings | |
The corrosion properties of Spacelab structural alloy aluminium 2219 -T851 | |
ESA-approved skills training schools : electronic assembly techniques | |
Evaluation of a process for the repair of area array and other surface mounted packages | |
Evaluation of cleanliness test methods for spacecraft PCB assemblies | |
Evaluation of conformal coatings for future spacecraft applications | |
Evaluation of test equipment for the detection of contamination on electronic circuits | |
Evaluation of the temperatures attained by electronic components during various manual soldering operations | |
Evaluation of thermally conductive adhesives as staking compounds during the assembly of spacecraft electronics | |
Evaluation of various solar-cell-to-interconnector welds by means of scanning laser acoustic microscopy and metallography | |
Examination of fused tin-lead plated printed-circuit boards supporting various surface features | |
Examination of new types of Raychem solder sleeves | |
Guidelines for creating a lead-free control plan | |
Impact of reworking ceramic area array packages on the integrity of the printed board laminate | |
An inspection of Spacelab hardware | |
An investigation into ball grid array inspection techniques | |
A Laboratory study of tin whisker growth | |
Materials and Processes : for Spacecraft and High Reliability Applications | |
Metallurgical assessment of spacecraft parts and materials, 1989: | |
The properties of near-eutectic tin/lead solder alloys tested between +70 and -60°C and the use of such alloys in spacecraft electronics | |
The resistance of space-quality solder joints to thermal fatigue |