Pecht, Michael
Pecht, Michael, 1952-....
Pecht, Michael G.
Michael G. Pecht American researcher
VIAF ID: 27138941 ( Personal )
Permalink: http://viaf.org/viaf/27138941
Preferred Forms
- 100 0 _ ‡a Michael G. Pecht ‡c American researcher
- 200 _ | ‡a Pecht ‡b Michael ‡f 1952-....
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- 100 1 _ ‡a Pecht, Michael
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- 100 1 _ ‡a Pecht, Michael
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- 100 1 _ ‡a Pecht, Michael
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- 100 1 _ ‡a Pecht, Michael
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- 100 1 _ ‡a Pecht, Michael
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- 100 1 _ ‡a Pecht, Michael, ‡d 1952-....
4xx's: Alternate Name Forms (12)
5xx's: Related Names (2)
- 510 2 _ ‡a Center for Advanced Life Cycle Engineering ‡g College Park, Md. ‡4 affi ‡4 https://d-nb.info/standards/elementset/gnd#affiliation ‡e Affiliation
- 510 2 _ ‡a University of Maryland ‡g College Park, Md. ‡4 affi ‡4 https://d-nb.info/standards/elementset/gnd#affiliation ‡e Affiliation
Works
Title | Sources |
---|---|
China's electronics industry : the definitive guide for companies and policy makers with interests in China | |
Copper Wire Bonding | |
Electrical connectors : design, manufacture, test, and selection | |
Electron. packaging ser. | |
Encapsulation technologies for electronic applications | |
Handbook of electronic package design | |
IC component sockets | |
Influence of temperature on microelectronics and system reliability | |
Integrated circuit, hybrid, and multichip module package design guidelines : a focus on reliability | |
The Korean electronic industry, 1997: | |
Lead-free electronics | |
Long-term non-operating reliability of electronic products | |
Optimum cooling of data centers : application of risk assessment and mitigation techniques | |
PHM 2012 | |
Physical architecture of VLSI systems | |
Placement and routing of electronic modules | |
Product reliability, maintainability, and supportability handbook | |
Prognostics and health management of electronics | |
Quality conformance and qualification of microelectronic packages and interconnects | |
Rare earth materials : insights and concerns | |
Reliability engineering | |
Risk-Based Engineering : An Integrated Approach to Complex Systems—Special Reference to Nuclear Plants | |
The Singapore and Malaysia electronics industries | |
Soldering processes and equipment | |
Strategies to the prediction, mitigation, and management of product obsolescence | |
Validation of a thermal model using infrared thermography, 1988: | |
WEEE, RoHS in kaj vse morate storiti, da se pripravite na elektroniko brez svinca |