Hsu, Tai-Ran.
VIAF ID: 50689261 ( Personal )
Permalink: http://viaf.org/viaf/50689261
Preferred Forms
- 200 _ | ‡a Hsu ‡b Tai-Ran
- 100 1 _ ‡a Hsu, Tai-Ran
- 100 1 _ ‡a Hsu, Tai-Ran
- 100 1 _ ‡a Hsu, Tai-Ran
- 100 1 _ ‡a Hsu, Tai-Ran
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- 100 1 _ ‡a Hsu, Tai-Ran
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- 100 1 _ ‡a Hsu, Tai-Ran
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4xx's: Alternate Name Forms (5)
5xx's: Related Names (2)
Works
Title | Sources |
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Advances in electronic packaging, 1995 : proceedings of the International Intersociety Electronic Packaging Conference, INTERpack '95 : presented at the International Intersociety Electronic Packaging Conference, March 26-30, 1995, Lahaina, Maui, Hawaii | |
Applied engineering analysis | |
Computer-aided design : an integrated approach | |
The finite element method in thermomechanics, 1986: | |
MEMS and microsystems design, manufacture, and nanoscale engineering | |
MEMS packaging | |
Theoretical basis for a transient thermal elastic-plastic stress analysis of nuclear reactor fuel elements | |
Thermal shock on a finite disc due to an instantaneous point heat source. |