American Society of Mechanical Engineers. Electrical and Electronic Packaging Division
American Society of Mechanical Engineers Electronic Packaging Division
VIAF ID: 135690420 ( Corporate )
Permalink: http://viaf.org/viaf/135690420
Preferred Forms
- 110 2 _ ‡a American Society of Mechanical Engineers ‡b Electrical and Electronic Packaging Division
- 110 2 _ ‡a American Society of Mechanical Engineers ‡b Electrical and Electronic Packaging Division
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- 110 2 _ ‡a American Society of Mechanical Engineers. Electrical and Electronic Packaging Division
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- 110 2 0 ‡a American Society of Mechanical Engineers. ‡b Electrical and Electronic Packaging Division
4xx's: Alternate Name Forms (12)
5xx's: Related Names (7)
- 510 2 _ ‡a American Society of Mechanical Engineers
- 510 2 _ ‡a American Society of Mechanical Engineers. ‡b Electronic and Photonic Packaging Division
- 510 2 _ ‡a American Society of Mechanical Engineers ‡b Electronic Packaging Division
- 510 2 _ ‡a American Society of Mechanical Engineers ‡b Electronic Packaging Division ‡4 vorg ‡4 http://d-nb.info/standards/elementset/gnd#precedingCorporateBody ‡e Vorgaenger
- 510 2 _ ‡a American Society of Mechanical Engineers ‡b Electronic and Photonic Packaging Division
- 510 2 _ ‡a American Society of Mechanical Engineers ‡b Electronic and Photonic Packaging Division ‡4 nach ‡4 http://d-nb.info/standards/elementset/gnd#succeedingCorporateBody ‡e Nachfolger
- 510 2 _ ‡a American Society of Mechanical Engineers ‡4 adue ‡4 http://d-nb.info/standards/elementset/gnd#hierarchicalSuperiorOfTheCorporateBody ‡e Ueberordnung
Works
Title | Sources |
---|---|
Advanced automotive technologies, 1995: | |
Computer aided design in electronic packaging | |
EEP | |
InterPACK'01 | |
Manufacturing processes and materials challenges in microelectronic packaging, c1991: | |
Poly'99 | |
Proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference | |
Structural analysis in microelectronics and fiber optics : presented at the 1993 ASME Winter Annual Meeting, New Orleans, Louisiana, November 28-December 3, 1993 | |
Thermo-mechanical characterization of evolving packaging materials and structures : presented at the 1998 ASME International Mechanical Engineering Congress and Exposition : November 15-20, 1998, Anaheim, California | |
Workshop on Polymeric Materials for Microelectronics and Photonics Applications, Mechanics, Physics, Reliability, Processing |