American Society of Mechanical Engineers. Electronic and Photonic Packaging Division
VIAF ID: 134753433 ( Corporate )
Permalink: http://viaf.org/viaf/134753433
Preferred Forms
- 110 2 _ ‡a American Society of Mechanical Engineers ‡b Electronic and Photonic Packaging Division
- 110 2 _ ‡a American Society of Mechanical Engineers ‡b Electronic and Photonic Packaging Division
- 110 2 _ ‡a American Society of Mechanical Engineers. Electronic and Photonic Packaging Division
- 110 2 _ ‡a American Society of Mechanical Engineers. ‡b Electronic and Photonic Packaging Division
4xx's: Alternate Name Forms (5)
5xx's: Related Names (5)
- 510 2 _ ‡a American Society of Mechanical Engineers
- 510 2 _ ‡a American Society of Mechanical Engineers. ‡b Electrical and Electronic Packaging Division
- 510 2 _ ‡a American Society of Mechanical Engineers ‡b Electrical and Electronic Packaging Division
- 510 2 _ ‡a American Society of Mechanical Engineers ‡b Electrical and Electronic Packaging Division ‡4 vorg ‡4 http://d-nb.info/standards/elementset/gnd#precedingCorporateBody ‡e Vorgaenger
- 510 2 _ ‡a American Society of Mechanical Engineers ‡4 adue ‡4 http://d-nb.info/standards/elementset/gnd#hierarchicalSuperiorOfTheCorporateBody ‡e Ueberordnung
Works
Title | Sources |
---|---|
Advances in electronic packaging, 2003 : presented at 2003 International Electronic Packaging Technical Conference and Exhibition : July 6-11, 2003, Maui, Hawaii | |
Integration and packaging of MEMS, NEMS, and electronic systems | |
InterPack '07 | |
IPACK2009 | |
Packaging, reliability and manufacturing issues associated with electronic and photonic products | |
Proceedings of the ASME InterPack Conference--2009 : presented at 2009 ASME InterPack Conference : July 19-23, 2009, San Francisco, California, USA |