International Society for Hybrid Microelectronics
国際ハイブリッドマイクロエレクトロニクス協会
International society for hybrid microelectronics (1967-2007)
VIAF ID: 134326735 ( Corporate )
Permalink: http://viaf.org/viaf/134326735
Preferred Forms
- 110 2 _ ‡a International Society for Hybrid Microelectronics
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- 110 2 _ ‡a International Society for Hybrid Microelectronics
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- 110 2 _ ‡a International Society for Hybrid Microelectronics
- 110 2 _ ‡a International Society for Hybrid Microelectronics
- 110 2 _ ‡a International society for hybrid microelectronics (1967-2007)
- 110 2 _ ‡a 国際ハイブリッドマイクロエレクトロニクス協会
4xx's: Alternate Name Forms (11)
5xx's: Related Names (3)
- 510 2 _ ‡a International Microelectronics and Packaging Society
- 510 2 _ ‡a International Microelectronics and Packaging Society (Washington, DC.)
- 510 2 _ ‡a International Microelectronics and Packaging Society ‡e Nachfolger
Works
Title | Sources |
---|---|
1996 International Symposium on Microelectronics : 8-10 October 1996, Minneapolis Convention Center, Minneapolis, Minnesota | |
Advances in resist technology and processing. | |
Developments in semiconductor microlithography II : [seminar], April 4-5, 1977, San Jose, California | |
Hybrid circuits | |
ICEMCM '95 | |
Int. j. hybrid microelectron. | |
International journal for ... Jan. 1978: | |
The International journal of microcircuits and electronic packaging. | |
Maikuro erekutoronikusu shinpojiumu ronbunshu. | |
Materials and processes for wireless communications | |
MCM '97 | |
Microelectronic processing technician course curriculum. | |
Multichip modules | |
Optical microlithography IV : March 13-14, 1985, Santa Clara, California | |
Proceedings | |
Reliability and yield problems of wire bonding in microelectronics : the application of materials and interface science | |
Submicron lithography | |
Thin film technology handbook | |
UGIM | |
University, Government, Industry Microelectronics Symposium | |
マイクロエレクトロニクスシンポジウム論文集. |