Components, Packaging & Manufacturing Technology Society
IEEE Components, Packaging, and Manufacturing Technology Society.
Components, Packaging, and Manufacturing Technology Society
Components, Packaging, and Manufacturing Technology Society (Polska Sekcja IEEE)
IEEE-CPMT
IEEE Components, Packaging and Manufacturing Technology Society (Etats-Unis)
IEEE Electronics Packaging Society
VIAF ID: 163847231 ( Corporate )
Permalink: http://viaf.org/viaf/163847231
Preferred Forms
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- 110 2 _ ‡a Components, Packaging & Manufacturing Technology Society
- 110 2 _ ‡a Components, Packaging & Manufacturing Technology Society
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- 110 2 _ ‡a Components, Packaging, and Manufacturing Technology Society
- 110 2 _ ‡a Components, Packaging, and Manufacturing Technology Society
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- 110 2 _ ‡a IEEE Components, Packaging and Manufacturing Technology Society (Etats-Unis)
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- 110 2 _ ‡a IEEE Electronics Packaging Society
- 210 | | ‡a IEEE-CPMT
4xx's: Alternate Name Forms (33)
5xx's: Related Names (9)
- 510 2 _ ‡a Components, Hybrids, and Manufacturing Technology Society
- 510 2 _ ‡a IEEE Components, Hybrids, and Manufacturing Technology Society
- 510 2 _ ‡a IEEE Components, Hybrids, and Manufacturing Technology Society.
- 510 2 _ ‡a IEEE Components, Hybrids, and Manufacturing Technology Society ‡4 vorg ‡4 http://d-nb.info/standards/elementset/gnd#precedingCorporateBody ‡e Vorgaenger
- 510 2 _ ‡a IEEE Electronics Packaging Society ‡4 nach ‡4 http://d-nb.info/standards/elementset/gnd#succeedingCorporateBody ‡e Nachfolger
- 511 2 _ ‡a IEEE/CHMT International Electronics Manufacturing Technology Symposium
- 510 2 _ ‡a Institute of Electrical and Electronics Engineers
- 510 2 _ ‡a Institute of Electrical and Electronics Engineers ‡4 adue ‡4 http://d-nb.info/standards/elementset/gnd#hierarchicalSuperiorOfTheCorporateBody ‡e Ueberordnung
- 510 2 _ ‡a Polska Sekcja IEEE
Works
Title | Sources |
---|---|
Advanced Packaging | |
Collection of papers presented at the ... International Workshop on Thermal Investigation of ICs and Systems | |
Electr. Des. Adv. Packag. Syst. Symp. (Print) | |
Electrical contacts. | |
Electrical performance of electronic packaging. | |
IEEE/CPMT Int. Electron. Manuf. Technol. Symp. | |
IEEE EDAPS | |
IEEE transactions on components, packaging, and manufacturing technology | |
Innovative Systems in Silicon | |
International Electronics Manufacturing Technology Symposium | |
Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems | |
ISSM | |
IWASI | |
"Low-cost manufacturing technologies for tomorrow's global economy" | |
Poly'99 | |
Proc. - Int. Conf. Innov. Syst. Silicon | |
Proceeding EMPC 2013 [Ressource électronique] : September 9th to 12th 2013, Grenoble, France | |
Proceedings | |
Proceedings of 2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '06) : June 27th-June 30 2006 : Shanghai University, Shanghai, China | |
Processes, properties and interfaces | |
T-CPMT | |
THERMINIC | |
Thirty-eighth International IMAPS-CPMT Poland Conference and Exhibition | |
Workshop on Polymeric Materials for Microelectronics and Photonics Applications, Mechanics, Physics, Reliability, Processing |