TMS Electronic Device Materials Committee
VIAF ID: 131462497 ( Corporate )
Permalink: http://viaf.org/viaf/131462497
Preferred Forms
4xx's: Alternate Name Forms (7)
Works
Title | Sources |
---|---|
Dislocations and interfaces in semiconductors | |
Metallic multi-layers and epitaxy, c1988: | |
Microstructural science for thin film metallizations in electronic applications, c1988: |