Co-ordination of microelectronics packaging and interconnection projects environment and trends for the development of European solutions
Co-ordination of microelectronics packaging and interconnection projects environment and trends for the development of European solutions (1997-2002)
VIAF ID: 126936369 ( Corporate )
Permalink: http://viaf.org/viaf/126936369
Preferred Forms
- 210 | | ‡a Co-ordination of microelectronics packaging and interconnection projects environment and trends for the development of European solutions
- 110 2 _ ‡a Co-ordination of microelectronics packaging and interconnection projects environment and trends for the development of European solutions (1997-2002)
4xx's: Alternate Name Forms (6)
Works
Title | Sources |
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Prooceedings of the 2nd International conference on benefiting from thermal and mechanical simulation in (micro)-electronics 9-11 April 2001, Maison de la chimie, Paris, France |