Institute for Interconnecting and Packaging Electronic Circuits Northbrook, Ill
Institute for Interconnecting and Packaging Electronic Circuits
VIAF ID: 126346394 ( Corporate )
Permalink: http://viaf.org/viaf/126346394
Preferred Forms
- 110 2 _ ‡a Institute for Interconnecting and Packaging Electronic Circuits
- 110 2 _ ‡a Institute for Interconnecting and Packaging Electronic Circuits
- 110 2 _ ‡a Institute for Interconnecting and Packaging Electronic Circuits (Northbrook, Ill.)
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- 110 2 _ ‡a Institute for Interconnecting and Packaging Electronic Circuits Northbrook, Ill
4xx's: Alternate Name Forms (5)
5xx's: Related Names (8)
- 551 _ _ ‡a Evanston, Ill. ‡4 orta ‡4 https://d-nb.info/standards/elementset/gnd#placeOfBusiness
- 510 2 _ ‡a IPC (Organization)
- 510 2 _ ‡a IPC - Association Connecting Electronics Industries
- 510 2 _ ‡a IPC - Association Connecting Electronics Industries ‡4 nach ‡4 https://d-nb.info/standards/elementset/gnd#succeedingCorporateBody ‡e Nachfolger
- 510 2 _ ‡a Institute for Interconnecting and Packaging Electronic Circuits Lincolnwood, Ill
- 510 2 _ ‡a Institute of Printed Circuits ‡4 vorg ‡4 https://d-nb.info/standards/elementset/gnd#precedingCorporateBody ‡e Vorgaenger
- 551 _ _ ‡a Lincolnwood, Ill. ‡4 orta ‡4 https://d-nb.info/standards/elementset/gnd#placeOfBusiness
- 551 _ _ ‡a Northbrook, Ill. ‡4 orta ‡4 https://d-nb.info/standards/elementset/gnd#placeOfBusiness
Works
Title | Sources |
---|---|
The 1998 market for electronics manufacturing ... c1999: | |
Hybrid microcircuit design guide, 1982 | |
IPC Printed Circuits Expo : IPC Printed Circuits Expo 2000 : technical proceedings, April 2-6, 2000, San Diego Convention Center, San Diego, CA. | |
Joint International Congress and Exhibition, Electronics Goes Green 2000+ : a challenge for the next millennium : proceedings : September 11-13, 2000, Berlin, Germany | |
Multichip modules : international conference and exhibition, 13-15 April 1994, Denver, Colorado | |
Printed wiring board industry and use cluster profile [MI] 1995: | |
Repair and modification of printed boards and electronic assemblies | |
Review (Institute for Interconnecting and Packaging Electronic Circuits (Evanston, Ill.)) | |
Review : IPC news and technology. | |
Surface mount solder joint evaluation : desk reference manual : DRM-SMT. | |
Troubleshooting for printed board manufacture and assembly | |
Where the boards are |